Hoʻopauʻo Kākoʻo Kūʻai Kūʻai

1. Hōʻikeʻike

Kāhaka kūʻai kūʻai (kaulana pū kekahi me ka "wax-wax") ua paliʻia no kona hiki ke hana i nā geomet paʻakikī, nā pāʻili, a me nā kiko'ī maikaʻi.

ʻO kekahi o kāna mau pono nui loa ma luna o nā hana kūʻai aku e pili ana i nāʻano hana nui loaʻo ia ka nui o nā mea kiʻekiʻe.

Eia nō naʻe, "Maikaʻi" maikaʻi "he mea kūpono loa i nāʻoihana nui-waiwai-nui e hoʻopau i nā hana hana pilikino, huahuwale, helehelena, a me ka heluʻana i nā kumukūʻai hana.

Hōʻike kēiaʻatikala i ka hoʻopukapukaʻana i ka laweʻana i ka paleʻana i ka wai mai nā kihi he nui: metrics a me ka ana, kaʻina hana, alloy hopena, ʻO nā hana mālama, nā koi hana, a me nā meaʻenehana e kū'ē nei.

ʻO kā mākou pahuhopu e hoʻokō i nā meaʻenehana, nā luna waiwai, a me nā mea hoʻolālā me kahi loea, ʻO ka hoʻomaopopoʻana i kaʻike pehea e koho ai i ka maikaʻi o keʻano o keʻano o ke kumukūʻai a alakaʻi i ka manawa.

2. Nā waihona kālā o ka hoʻopukapuka kālā

ʻO Overview o ke kaʻina hana nalowale-wax

Ka papa Kāhaka kūʻai kūʻai Ua hoʻopiʻi nā mea hana iʻehā mau kūlana nui:

1. ʻO ka hana kumu kūʻai: Ua hōʻoleʻiaʻo Molten Wax i kahi make metala reustable e hana i nā replicas o ka geometry hope loa.
   Ma hope o ka holoiʻana, laweʻia nā hiʻohiʻona a hōʻuluʻulu i nā'ōnaehana geting / system ("Nā lāʻau").
2. Kaila: Ua hoʻokaʻawale pinepineʻia ka hālāwai wax i kahi slurry clur (ʻO ka Silica Silica a iʻole Zircium) a me nā mea i hoʻopaʻaʻia me ka stucco stucco.
   Nā papa he nui (maʻamau 4-8) Hāʻawi i kahi Shell 6-15 mm mānoanoa, Ke hilinaʻi nei i ka nui o ka'āpana. Mahele waena ma kēlā me kēia waihona.
3. Dewaxing a me ke ahi: ʻO nā mea i hoʻopaʻaʻia i ka ulia e hoʻoheheʻeʻia a hui pū i ka wax, e waiho ana i kahi lua.
   He soak kiʻekiʻe loa (800-1200 ° C) nā mea hewa i kaʻili, e lele ana i ke koena koena, a me nā prime the cavity i luna no ka hoʻopiha piha.
4. Ka nininiʻana a me ka hoʻoponoponoʻana: Palapala Molly (alloy-cime-cimed ± 20-50 ° C superheat) ua nininiʻia i loko o ka shell.
   Ma hope o ka hoʻopaʻaʻana i ke kāohi, ʻO kaʻili a iʻole ke kāweleʻia, a uaʻokiʻia nā hale kūʻai pilikino mai ka'ōnaehana gating.

Nā mea maʻamau a me nā mea hana maʻamau i hoʻohanaʻia

ʻO ka hoʻolaunaʻana i nā mea kūʻai aku i kahi wahi ākea ākea o nā alloys:

• Nā pāpale & Nā mea kanu lāʻau (E.g., AISI 410, 17-4 Ph, 316L)
• Nā mea kanu nckel (E.g., Actoel 718, Haynes 282)
• ʻO COBALTT-Chromium Alloys (E.g., Cocrmo no nā mea maʻi olakino)
• Apana Apana Aluminum (E.g., A356, 7075)
• Liulaala a me nā mea nui (E.g., C954 Bronze, C60 keleawe)
• Titanium a me kona mau alloys (Ti-6al-4v no nā'āpana aerospace)

Anaʻia e like me ka mea e like me ka paʻakikī Ra 0.8 μM i RA 3.2 }m, Ke hilinaʻi nei i ka hana a me nā kiko'ī kiko'ī.

He ʻokoʻa, ʻO Sand Canding pinepine nā mea hāʻawi ~ ra 6 μM i RA 12 }m, a e make ana 1.6 μM i RA 3.2 }m.

3. E hoʻopau i nā metrics a me ka anaʻana

Nā hiʻohiʻona paʻakikī (Ra, Rz, Rq, T)

• Ra (ʻO ka paʻakikī a me keʻano paʻakikī): ʻO ke kumu o nā hana pilikino o kaʻikepili o ka sticleness. Ka mea maʻamau i hōʻikeʻia.
• Rz (Kiʻekiʻe kiʻekiʻe kiʻekiʻe): Ka awelika o ka huina o ka nui kiʻekiʻe a me ke awāwa haʻahaʻa loa ma waena oʻelima mau lōʻihi; ʻoi aku ka nui o nā mea nui.
• Rq (ʻO ke kumuʻo keʻano paʻakikī): Ke kumu o ka pahu o ka awelika o nā mea i hoʻopaʻaʻia; like me keʻano like me ke kaupaonaʻana i nā'ōlelo nui.
• T (Huina kiʻekiʻe): ʻO ka lōʻihi o ka lōʻihi ma waena o nā wahi kiʻekiʻe a kiʻekiʻe loa ma luna o ke awāwa e pili ana i ka lōʻihi o ka lōʻihi.

Nā mea hana maʻamau

• Hoʻokaʻaʻike Stylus Proficomers: ʻO kahi mea i hoʻopaʻaʻia i ka stylus styled style style ma waena o kaʻaoʻao ma lalo o ka ikaika o ka mana. Kāleka Recien ~ 10 Nm; maʻamau ma mua o ka sampling ma 0.1 mm.
• ʻO Laser Scanning / Profile Microscopes: ʻO keʻano o keʻano e pili ana i ka hoʻohanaʻana i kahi wahi i hanaʻia a iʻole nā ​​mea optics optics. Mālama i ka 3d Tophigraphitory match me ka loaʻaʻana o kaʻikepili wikiwiki.
• Keʻokeʻo keʻokeʻo keʻokeʻo keʻokeʻo keʻokeʻo: Hāʻawi i ka hoʻonāʻana o Subron Version, Kūpono no nā papa kūpono (<Ra 0.5 }m).
• Nā'ōnaehanaʻike me ka mālamalama i hoʻonohonohoʻia: Hopu i nā wahi nui no ka nānāʻana i ka laina, ʻOiai ua kaupalenaʻia i ka hopena kūlike (~ 1-2 μM).

Nā Kūlana Kūʻai a me nā Tolercess

• Astm b487 / b487m (ʻO nā mea kūʻai aku i nā mea kūʻai akuʻo Steel)
• Iso 4287 / Iso 3274 (Nā huahana geometrical huahana)
• Mea kūʻai aku-i nā mea kūʻai aku-e.g., KE LOA AOLESPACE OFFOLICE Sithic Dactie: Ra ≤ 0.8 }m; Nā papahele I nā lāʻau lapaʻau: Ra ≤ 0.5 }m.

4. ʻO nā mea e pili ana i ka hoʻopauʻana i ka nohoʻana

ʻO ka maikaʻi o keʻano hoʻohālike

ʻO Wax Formulation a me nā hiʻohiʻona papa

• Wax Kakuhi: Paraffin, micrrystalliselline wax, aʻo Polymer e hoʻopili ai i ka maʻalahi, Malting Point, a me ka shrink.
  Hoʻokomoʻia nā formium Wax Wax i nā microfillers (ʻO Pystyrene Beads) e hōʻemi i ka shriknige a hoʻomaikaʻi i kaʻili.
• Nā hiʻohiʻona hoʻohālikelike: Mold mahana, Ke paʻakikī, ʻO ka manawa hoʻomaha, a make i ka maikaʻi e pili ana i keʻano o keʻano.
  He make make (~ kalima-hoʻopau) E wehe i ka haʻahaʻa haʻahaʻa haʻahaʻa (~ Ra 0.2-0.4 μm). Hiki i ka bessitedard make i hiki ke hoʻomaopopo i nā mākaʻo Wafftor ejector a iʻole nā ​​laina i hoʻopaʻaʻia i kaʻili.

Nā Kūlana Kūʻai Kūʻai (Iniha molding vs. 3D paʻi)

• Ka hoʻohālikelikeʻana i nā molding: Nā lole lole, nā hiʻohiʻona maikaʻi loa i hanaʻia i ka wā e mālama maikaʻiʻia nā make.
• 3D-phymer Poolmer (Binder Jet, Lapala): Hiki i nā loli geomidry geometry e loli me kaʻole o ka mea kūʻai aku.
  ʻO ka paʻakikī likeʻole (~ Ra 1.0-2.5 μm) unuhi pololei i kaʻili, e pono ai i ka hoʻopili houʻana (E.g., kaʻokiʻana i kahi slurry maikaʻi a iʻole e hoʻopili ana i kahi kapa wape i mālamaʻia).

Shell Moll Composition a noi

ʻO nā kākā'ōlelo mua a me nā luna: Ka nui o ka palaoa, NāʻAmelika Bonding

• ʻO ka uhi mua ("Stucco"): Maikaʻi loa (20-35 μm silica a zircon). ʻO nā mea nui Finner e hana i lalo o ka paʻakikī (RA 0.8-1.2 μm).
  Nā papaʻa (75-150 μm) Hāʻawi Ra 2-3 μm akā hoʻomaikaʻi i ka paleʻana i keʻano o ke aniani.
• Ke hoʻomoʻa nei i ka slurry: Cilica Silica, Etyl silitate, a iʻole zircon Solders Binders; Ua pili nāʻike a me nā mea i loaʻa i ka solids.
  ʻO ka uhiʻana o ka uhiʻana me nā pineʻole e pale aku i ka paleʻana i nā spike paʻakikī.
• Backup "stucco": Ka hoʻonuiʻana i ka nui o ka'āpana (100-200 μM) Me kēlā me kēia papa hana i nā papa inoaʻo Found Faidity no ka ikaika o Shell; ʻO Vinyl a iʻole restictory Binders e hoʻohālikelike i ka shriknizage a me ka adhesion.

Ka helu o nā'āpana a me nā mānoanoa

• Nā'ōpū (4-6 nā lole, 6-8 mm): Hāʻawi i nāʻano haʻahaʻa haʻahaʻa haʻahaʻa (< ± 0.2 mm) a me nā kiko'ī koʻikoʻi akāʻo ka pilikia o ka mea i paleʻia i ka wā dewax. ʻO keʻano maʻamau: RA 0.8-1.2 μm.
• Nā Kahu Uila (8-12 mau moku, 10-15 mm): ʻOi aku ka maikaʻi o ka robust no nā alloys nui a iʻole exothermic a hiki ke hana i ka "print-print-hopena", ka liʻiliʻi o ka hoʻopiliʻana i nā hua'ōlelo stucco ma muli o ka neʻeʻana.
  E like me ka heleʻana: Ra 1.2-1.6 μm.

ʻO nā hopena dewaxing ma ke kūpaʻa

• Steam Autoclave Dewax: Hiki i ka Rapid Wax Evacuation hiki ke hoʻonāukiuki i ke kaumaha i ke kaumaha ma mua, e hōʻeha ana i nā microcracks e hoʻopili ana i kaʻili.
  Nā Kūlana Kūleʻa Kūleʻa a me nā pōkole pōkole (2-4 min) nā mea hana i nā hemahema.
• Umu dewax: Lohi burnout (6-10 h ramp a 873-923 K) hoʻemi i ke kaumaha akā hoʻopau i ka manawa hou, Hoʻonui ka uku.
• Hopena i ka pau: Hiki i kahi pahu o kaʻili o ka uhi o ka uhi e waiho ai i nā pale refractory maikaʻi loa i ka paleʻana i ka pale, eʻoluʻolu (E.g., Ua lele mai nā ramps mai 1.0 μm i 1.5 }m).

Dewaxing a me ka preheating

ʻO ka hoʻonuiʻana o ka hanaʻana o ka wax a me nā'ūhā checking

• ʻO Wax Coop (~ 800 × 10⁻⁶⁻⁶ / ° C) vsa. ʻO kaʻili cemic (~ 6 × 106 ° C): ʻO ka hoʻonuiʻana i ka expansion i ka wā o Steam Dewax hiki ke pale i kaʻili ināʻaʻole lawa.
• Nā hoʻonohonoho hoʻonohonoho: ʻO kahi kūpono o nā'āpana (luna o ka lāʻau, kokoke i nā'āpana liʻiliʻi) aeʻaeʻo Wax e pakele me ka hoʻopiʻiʻoleʻana i ka interior.
• E hoʻopau i ka hopena: Nā mea e hele ai e hele i kahi waihoʻoleʻia "stucco lepo" i ka wā o ke aila, e pili ana i nā wahi ākea (Ra > 2 }m).

Ke kāohi nei i ka Burnout e hōʻemi i nā hemahema

• Nā Kūlana Ramp-Soak: E lohi (50 ° C / H) a i 500 ° C, A laila e paʻa no 2-4 h e hoʻopau piha i nā pale a me ka wax.
• ʻO ka hakahaka a iʻole nā ​​mea e ulu ai: Hoʻemiʻia nā wahi haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa, ka hoʻohaʻahaʻaʻana i ka pīhoihoi. Mālamaʻiaʻo Shell itegrity, Hoʻopili i ka fudlity plan.

Melt a e ninini ana i nā'āpana

Ka wela wela, Superhaeat, a me ke kino

• Superhaeat (+20 ° C i +50 ° CUM ORTER ma luna): E hōʻoia i ka momona, hoʻemi i nā pana anuanu.
  Akā naʻe,, superheat nui (> +75 ° C) Hōʻike i nā mea koho balota a me ka ENDED e komo ana, e alakaʻi ana i ka paʻakikī.
• ʻO nā loli likeʻole:

• • Apana Apana Aluminum: Nā haʻahaʻa haʻahaʻa haʻahaʻa (660-750 ° C), ʻO ke kino kiʻekiʻe; as-thore ra ~ 1.0 μm.
  • Nickel mau: Hoʻoheheʻeʻia ma 1350-1450 ° C; haʻahaʻa haʻahaʻa, ʻO ka pilikia o ka nānāʻana i ka chill-hopena i nā'āpana liʻiliʻi (Ra 1.6-2.5 μm).

• Fluxing and degusinging: Ka hoʻohanaʻana i nā dechers stols subseds a iʻole nā ​​flux hoʻohui e hōʻemi i nā hydrogend hydrogen (AL: ~ 0.66 ml H₂ / 100 g at 700 ° C), ka hōʻemiʻana i ka micro-poosity e hiki ke hōʻeha i ka paʻakikī.

E ninini ana i ka wikiwiki a me ka turbubucence

• Laminar vs. Kahe kahe: E hoʻopiha i ka laminar (< 1 m / s) pale aku i ka hoʻopiliʻana o ka oxde. No ka hollow a iʻole nā ​​mea kūʻai aku, ke kāʻeiʻana i ke alohaʻana me nā kānana cemik (25-50 μm) E kahe ana i nā kahe.
• Ninini i nāʻenehana:

• • Polu lalo: Minor Turbulence; makemakeʻia ma nā hale kūʻaiʻo Aerospace.
  • Top no: Ka hopena o nāʻino oxide; Hoʻohana i ka hoʻohanaʻana i nā mea kūʻai aku i kōkua i ka hoʻopauʻana i ka kahe.

• Hopena hopena: Hoʻokomoʻiaʻo Turbulence i nā manaʻo oxdide e pili ana i ka paia o ka lua, e hōʻeha ana i nā micro (Nā SPECIWS > 3 μM i nā wahi kūloko).

Hōʻoia a me ka hōʻoluʻolu

ʻO kaʻaihue Thermal Thermal a me ka hoʻomahaʻana

• Nā hiʻohiʻona 'opio: Kāwili Silica Shells (~ 0.4 w / m · k) ʻOi aku ka lohi ma mua o Zircon Shells (~ 1.0 w / m · K).
  ʻO ka lohiʻana i ka hanaʻana i kahi hoʻolālā dendritic fendritic finter me nā palena'ōpala (~ Ra 1-1.2 μm) Nā Kūlana Kūʻai Kūlana (RA 1.5-2.0 μM).
• ʻO ka wahi puna a me nā moa: Hoʻokomoʻia nā chulls (keleawe a kila paha) E hōʻemi i nā wahi wela, ka hōʻemiʻana i ka papa o ka papa ma muli o keʻano o ka uniform.

ʻO nā wahi wela a me nā'ōiwi

• Nā hana exothermic i loko o nā'āpana-nui: Hiki i nā Hotspots kūloko ke hoʻopau i ka hoʻoponoponoʻana, Ke hana nei i keʻano o ke kino "Orange Peel".
• Miomi: E hoʻohana i nā mea kanu e hānai ai a iʻole nā ​​moa e kāohi i nā manawa hoʻoponopono kūloko. E hōʻoia i ka ulu uluʻana o ka palaoa, Ke hoʻopauʻana i kaʻaoʻao < Ra 1.0 μM i nā wahi koʻikoʻi.

ʻO ka holoiʻana a me ka hoʻomaʻemaʻe

Mea Ho'ālika Koa. Kekuhi

• Knokaiia Knockon: ʻO ka pīhoihoiʻo Vibratory, Akā hiki ke hōʻiliʻili i nā pahu refractory maikaʻi loa i loko o kaʻaoʻao metala.
  Hoʻemi ka hoʻoikaika Minemal Vibratory i hoʻohuiʻia, ka hāʻawiʻana i ka pou-knockout ra ~ 1.0-1.5 μm.
• Kekuhi (ʻO nāʻauʻau paʻakai māmā, Nā hoʻonā Acdac): E hoʻokuʻu i ka lāʻau silica ma waho o ka ikaika o ka mīkini, e mālama maʻamau i kahi papa maikaʻi (RA 0.8-1.2 μm) akā koi i nā mea paʻa paʻa paʻa a me ka nānāʻana i nā protocols.

ʻO ka haʻaleleʻana o ka pale pale pale (Pana pua, Nāooktrasonics)

• Pana pua: Me ka hoʻohanaʻana i nā beads aniani (200-400 μM) I nā koina hoʻomalu (30-50 psi) Hoʻopau i nā mea noho noho a me nā'āpana o nā kukui uila, ʻO ka ho'ākākaʻana i ka papa i ka mos 0.8-1.0 μm.
  Hiki i ke kauʻana i ka paleʻana i ka hoʻouluʻana, hoʻololi i nā micro-topography (Ra ~ 1.2 μm).
• ʻO ka hoʻomaʻemaʻe hoʻomaʻemaʻe: ʻO ka cavitation i loko o nā mea hoʻoponopono e hoʻopau ai i ka lepo e hoʻopau i ka lepo maikaʻi me kaʻole o ka hoʻololiʻana i nā micro-ʻano.
  Hoʻohana pinepineʻia no nā mea lapaʻau a iʻole nā ​​hale kūʻaiʻo Aerospace ma kahi liʻiliʻi (<Ra 0.8 }m) He koʻikoʻi.

5. Nā mea waiwai a me nā mea noʻonoʻo

Ka hopena o ka chemistry aloket

• Apana Apana Aluminum (A356, A380): Hoʻokumuʻo Rapid oxidation i kahi kiʻiʻoniʻoni; E like me nā palena o nā huapalapala e waiho ai i nā palena liʻiliʻi. RA 0.8-1.2 μm i loaʻa.
• Nā mea kanu lāʻau (316L, 17-4 Ph): ʻO nā puka kīwī sc₂o₃ i hana ai i ka pō; moloka (ferrite vs. ʻO kahi ratio ausedite) nā hopena "ʻokoʻa." RAND maʻamau 1.2-1.6 μm.
• Nickel mau (Actoel 718): Emi iki, ʻoi hou hou; ʻO Superalrey Oxide Adhees Shickeres, Aʻo ka hiolo o ka huiʻana e hiki ke hoʻonāukiuki i ka "e pale ai" o NI ma ka piliona.
  ʻO ka hoʻopiliʻana i nā mea paʻa e hōʻemi ai i RA i ka 1.6-2.0 μm.
• Nā alloys (Cocrmo): ʻOi aku ka paʻakikī, ka hoʻohaʻahaʻa haʻahaʻa haʻahaʻa; E hoʻopau pinepineʻia ka lani ~ RA 1.5-2.0 μM keʻole e hoʻohana ai i ka mea kūʻai aku i ka Zircon / Mulite me ka palaoa maikaʻi.

Nā hana maʻamau a me ko lākou mau hana maʻamau

ʻO Grain Structure a me nā hopena shrink i nā mea i hōʻikeʻia

• Kuhikuhi i ka hōʻoia: E kāohiʻia e ka mānoanoa a me nā chills e hoʻokō ai i ka nui o ka palaoa palaoa (<50 }m) ma ka papa. ʻO nā mea nui Finder e hana i nā papa smoother.
• ʻO nā alahaka a me nā wahi wela: Hiki i ka hoʻoponopono kūpono ke hana i nā'āpana liʻiliʻi "sink i nā hōʻailona" a iʻole nā ​​"dimples" kokoke i nā'āpana kaumaha.
  ʻO ka heleʻana a me ka hoʻohālikelikeʻana i nā hiamoe i nā pōpoki kūloko i nā wahi o ke kino ma mua (ʻO ka mālamaʻana i ka loli < 0.3 μM ma waena o ka'āpana).

6. ʻO ka mālamaʻana i nā mea mālama ponoʻana

ʻO kaʻoi aku ka maikaʻi loa e like me ka hoʻopau pinepineʻana i nā kaʻina hanaʻelua e hoʻokō i nā kiko'ī paʻa. Ma lalo o nā hana paʻa loa i nā hana a me ko lākou mau hopena ma ka hopena.

Ke kālaiʻana a me ka machining

• Nā lako hana & Nā pameters:

• • Turmesn carbide & Cbn inters No nā mea hoʻokele a me nā mea kanu; nā mea hana kaʻa kaʻa kaʻa no ka alumini.
  • E hānai i nā uku: 0.05-0.15 mm / rev no ka huliʻana; 0.02-0.08 mm / rev no ka milling; hoʻemi haʻahaʻa i ka wā e kau ana i ka ra < 0.4 }m.
  • ʻOkiʻoki i nā wikiwiki:

• • • Aluminum: 500-1000 m / me (hoʻopau i ka pass).
    • Meaʻole: 100-200 m / i (hoʻopau i ka pass).

• Kūlike loa ka helehelena: ʻAʻole kūpono i nā parameters i ke kamaʻilio kūkākūkā a i kūkuluʻia paha, e ala ana i ka r i 1.0-1.5 μm. Loaʻa i nā hiʻohiʻona koho Ra 0.2-0.4 μm.

Freasive blasting

• Koho Apana:

• • Nā aniani aniani (150-300 μM): Honu i ka honi, ʻO ka hoʻopauʻana Matte (RA 0.8-1.0 μM).
  • NALUNA KAHANA (50-150 μm): ʻOi aku ka ikaika; hiki ke wehe i nā pā liʻiliʻi liʻiliʻi akā paha e makemake i nā alloys, ka hoopau ana ra 1.2-1.6 μm.
  • Nā Beads CEMIM (100-200 μM): ʻO ke kaulike wikiwiki a me kaʻakaʻaka; Kūpono no ka meaʻole, hoʻokō iā RA 0.8-1.2 μm.

• Ka paipai & Kūlehu: 30-50 psi ma 45 ° -60 ° i ka hoʻomaʻemaʻeʻana i ka hoʻomaʻemaʻeʻana i ka hoʻomaʻemaʻeʻoleʻana.

Pohō a me kaʻiliʻana

• ʻO ka holomua o ka holomua GRIT:

• • Hoʻomaka me 320-400 grit (Ra 1.0-1.5 μm) → 600-800 grit (Ra 0.4-0.6 μm) → 1200-2000 grit (RA 0.1-0.2 μm).

• Pohō:

• • Nā Aumina paste (0.3 }m) No ka hoʻopau hope.
  • Slurry slurry (0.1-0.05 μm) no ka papa aniani (Ra < 0.05 }m).

• Nā Pono Hana: Nā huilaʻo Buff Buff (No nā papa hana), ʻO nā Polistory Polishirs (No nā mea paʻakikī).
• Noi: Kōhai, NA KEKI ANA, nā mea hoʻohālikelike e koi ana i ka noʻonoʻo kiko'ī.

Kemika a me nā electrochemical hoʻopau

• Pickling: ʻO nāʻauʻau ACIDIC (10-20% hcl) wehe i ka scale a me ka momi sub-sub-sub-sub. Pilikia a koi aku i ka neutralization. Maʻamau: E hoʻomaikaʻi mai 1.5 μM e ~ 1.0 μm.
• Hoʻolauna (no ka mea ole): ʻO ka nitric a iʻole citric acid e hoʻopau i ka hao hao, hoʻonui i ka pale pale pale cr₂o₃; ʻO ka hoʻemiʻana o Net Ra ~ 10-15%.
• Uilaiauliwi: ʻO kahi dissolution Anodic ma phosphoric / sulfuric acid electrolyte.
  ʻO nā mea leʻaleʻa i nā micro-asperties, ka hoʻokōʻana i ka SM 0.05-0.2 μm. Maʻamau no ke olakino, AerERPPACE, a me nā noi kiʻekiʻe kiʻekiʻe.

Nā pāpale a me nā kahua

• ʻO ka paleʻana: Polyesster a iʻole nā ​​epoxy powders, ho'ōlaʻia iā 50-100 μm mānoanoa. E hoʻopiha i nā micro-valleys, ʻO ka hāʻawiʻana iā Ra ~ 1.0-1.5 μm ma kaʻaoʻao hope. Hoʻohana pinepineʻia nā kumu mua e hōʻoia i ka adhesion.
• Wahi Koho (I, Cu, Zn): Nā waihona uila Nickel (~ 2-5 μm) ʻO ka hapa maʻamau he 0.4-0.6 μm. Koi pono i mua-polish i ka haʻahaʻa haʻahaʻa e pale ai i ka hoʻonuiʻana i nā micro-defects.
• Nā lole coaterage (Dlc, Pvd / cvd): Ultra-thin (< 2 }m) a me Confform. Kūpono ināʻo RA < 0.05 μM e koiʻia no ka lole a iʻole nā ​​papahele.

7. E hoʻopau i ka hopena i ka hana

Nā Pīkuhi Propertinies: Kaluhi, ʻAʻa, Nā mea hoʻohālikelike koʻikoʻi

• Kaʻa Kaʻamae: Kēlā me kēia'āpana o Ra (E.g., Mai 0.4 μm i 0.8 }m) hiki ke hōʻemi i ka ikaika o ka hōʻeha ma ~ 5-10%. ʻO ka hanaʻoniʻoniʻo Sharp.
• E kāʻei i ke kū'ē: Nā papahele (Ra < 0.4 }m) ho'ēmi i nā lole abrasive i loko o nā hui sliding. Rouggher extehes (Ra > 1.2 }m) Nā'ōpala Hō'ī, ka hoʻokaʻawaleʻana iʻelua mau kino.
• Hoʻopiʻiʻia: ʻO nā micro-norches mai nā papa heʻe i ka neʻeʻana i ke kaumaha ma lalo o ka laweʻana.
  Ke hoʻopauʻana e wehe >95% ʻO nā micro-asperities he koʻikoʻi no nā'āpana momona kiʻekiʻe (E.g., aiesetpace turbine housses).

Corrosiotion pale a me ka hoʻopiliʻana

• Corrosionion ma lalo o nā crevices: Hiki i nā papa he mau mea nāhelehele e hana i nā micro-crevices, ka hoʻopiliʻana i keʻano kūloko. Nā papahele (Ra < 0.8 }m) ho'ēmi i kēia pilikia.
• Kāʻei lole: Kekahi mau lole (E.g., ʻO nā kiʻi paʻi fluoropoloe) koi i kahi paʻa paʻa (Ra 1.0-1.5 μm) E hoʻokō i nā mea hana mechanical.
  Inā maikaʻi loa (Ra < 0.5 }m), ʻO nā hoʻolaha hoʻolaha hoʻolaha a iʻole nā ​​mea nui e pono ai.

ʻO ka pololei a me ke kūpaʻa kūpono

• Nā papa i ka paia: I nā'āpana Hydraulic, a 0.1 Hiki iā MM Gap ke nohoʻia e nā micro-asperties inā ra > 1.0 }m.
  Machining a iʻole ka mana o ka mana o ka mana e hōʻoia ai i ka hoʻomaʻemaʻe kūpono (E.g., piston / cylinder kūpono kūpono < 0.4 }m).
• Nā papahele e ana ana: Ra < 0.8 μM i kauoha pinepineʻia no nā maka static (Nā Flax Flanger, Nā noho kūʻai Valve); Finer Ra < 0.4 μM pono pono no nā hōʻailona koʻikoʻi (Nā'āpana).

Aesthetics a me nā mea kūʻai aku

• Nā mea nani a me nā mea hoʻonaninani: ʻO ka hoʻomaʻemaʻeʻana (Ra < 0.05 }m) E haʻi iāʻoe i ka momona. ʻO kekahi mau micro-defect i ka noʻonoʻoʻana, hōʻemi i ka waiwai iʻikeʻia.
• Ka manuahi: Nā wahiʻike (lima lima, Nā Plaqques) pinepine pinepineʻia e RA < 0.8 μM e pale i ka tarnish a mālama i keʻano o keʻano ma lalo o ke kukui pololei.

8. Nā pono hana-pono

AerERPPACE

• Na'Āpana Engine (Nā kāpenaʻo Turbine, MALEs): Ra ≤ 0.8 μM e pale ai i ka maʻi aerondynamic.
• Hana kūpono: Ra ≤ 1.2 μM post-has, A laila makika i ka rada 0.4 μM no nā'āpana momona-koʻikoʻi.

Nā Pūnaewele Pūnaewele

• Nā manaʻo (Hip Stems, Nā Opehu Detunes): Ra ≤ 0.2 μM e hōʻemi i ka adhesion bacterial; Nā papa uila (0,05-0-0.1 μm) E hoʻonui pū i ka bioompatibila.
• Nā mea kani: Ra ≤ 0.4 μM e hoʻomaʻamaʻa i ka sterilitate a pale i ka kūkulu hale.

Aitompetitive

• Nā Caliper Calipers & Nā Hale Hōʻikeʻike: Ra ≤ 1.6 μM e like me-lawe; ʻO nā papa hana ma kahi i hana pinepineʻia i RAD ≤ 0.8 μM no ka hōʻailona kūpono a hoʻopaʻa i ke kū'ē.
• Aesthetic Trim: Ra ≤ 0.4 μM post-polish a iʻole ke kāʻeiʻana no ka hoʻopiliʻana i ka pūpū stristent stros a me ka hoʻopiliʻana.

Pono & Aila

• Nā kino valve, Nā mea hana pump: As-beat ra ≤ 1.2 }m; Hoʻokomoʻia nā wahi e hoʻopili ai i nā frasid frasive i kekahi manawa grit-blasted to ra 1.2-1.6 μm e hoʻomaikaʻi ai i ke kū'ē.
• ʻO Middy: Ra ≤ 1.0 μM e pale aku i nā micro-leaks ma lalo o nā underlays a iʻole ka hoʻopiliʻana.

Mea nani a me nā kiʻi

• Nā kīwaha, Nā poʻe Pendants, Nā lei: Ra ≤ 0.05 μ.
• Anti me Expaxiles: Kāohi i ka hoʻohālikelike (Koi aihewa) me ra ~ 0.8-1.2 μm i kaʻike kiko'ī.

9. Ka mana kūpono a me ka nānāʻana

Ke nānā nei i keʻano hoʻohālike o Wax Wax

• Nānā nānā: Eʻimi i nā hōʻailona sink, Nā laina palaka, ʻO nā hōʻailonaʻo Faint ejector.
• Paulele: ʻO ka sampling sampling o nā papa papa; ʻaeʻia RE ≤ 0.4 μM ma mua o ka heleʻana.

ʻO nā leka liʻiliʻi

• Shell thinness kūlohelohe: ʻO Ultrasosi ka hana i nā'āpana koʻikoʻi; ± 0.2 mm tolerance.
• Nā loiloi Prossity: Dye penetrant ma nā coupons liʻiliʻi liʻiliʻi; Oliana > 0.05 MM PORRES ma luna o ka papa mua.

E like me ka pahu pahu

• Hoʻokaʻaʻike aʻoleʻole e pili ana i ka profiomotry: Ana e ana i ka elima a me ka helu he umi no nā hiʻohiʻona hapa (flanges, nā helehelena hōʻailona).
• Mau koi no kaʻaeʻana:

• • Māhele nossopace koʻikoʻi: Ra ≤ 0.8 μ 0.2 }m.
  • NA KEKI ANA: Ra ≤ 0.2 μ 0.05 }m.
  • Peopleʻoihana: Ra ≤ 1.2 μ 0.3 }m.

ʻO ka nānā hope loa ma hope o ka hoʻoiliʻana

• 3D topography mapport: Laser Schuning no ka papa holoʻokoʻa; E hoʻomaopopo i nā mea kiʻekiʻeʻo RO "SPIKES."
• Nā hōʻike hōʻike o ka adhesion: Hele-hatch, ʻO nā hoʻokolohua huki e hōʻoia i ka pena pena a iʻole ka hanaʻana i ka hana ma nā rungs kūikawā.
• Micro-bildismitis: ʻO ke kiʻi uila (Nā) E hōʻoia i ka halaʻole o nā micro-cracks a iʻole nā ​​mea i hoʻopiliʻia ma nā wahi koʻikoʻi.

Nā Kūlana Kūʻai Statistical (Spc)

• Nā Kūlana Kūlana: Track ra ma luna o nā balota-ucl / lcl / lcl i hoʻonohonohoʻia ma ± 1.5 μm a puni ke kaʻina hana.
• Cp / cpk loiloi: E hōʻoia i ka hiki i ke kaʻina hana (Cp ≥ 1.33) No nā hiʻohiʻona nui.
• Hoʻomaʻamaʻa mau: ʻO ke kumu kumu e nānā ai no nā hōʻailona o waho (Nā 'Toodts Wax, nāʻili, Melt Temp Anomalies) e hōʻemi i kaʻano.

10. ʻO ka loiloi uku uku

Kālepa-puka: Shenxcity vs. Hana hana

• ʻO ka Shemiki Premium (Maikaʻi loa, Nā lole'ē aʻe): Hoʻonui i ka uku o ka mea kūʻai ma 10-20 % akā e hōʻemi i ka post-subnding / polishing e 30-50 %.
• Nā Palakiʻoihana (ʻO ka paleʻana o ka pale, ʻO nā lole liʻiliʻi): ʻOkiʻoki i nā kumukūʻai 15 % akā e kau ana i nā kumukūʻai makika ma lalo e hoʻokō ai i ka hopena o ka pauʻana o ka helu helu helu helu inā pono keʻano nui.

Hoʻohālikelike i ka hoʻopuka kālāʻana. Matching mai ka pale

• 'Ōnē, ʻO ka geometry paʻakikī: E hoʻolei ana i nā hua i kahi kokoke i ka net 1.0 μM e like me-lawe.
  Machning mai ka bilika no ka bilika e koi ai i ka laweʻana i ka laweʻana; ʻO ka hope RAX X4-0.8 μm akā ma 2-3 × Pili a me ke kumukūʻai.
• Nā hua'ōlelo haʻahaʻa haʻahaʻa: 3Nā hiʻohiʻona waiwai D-PRGETED (Ra 2.0 }m) hiki i ka cnc post-prosined i ra 0.4 }m, Ke alakaʻi nei i ka manawa alakaʻi a me ka heleʻana.

Lean Fatemeges: ʻO ka liʻiliʻi o ka hanaʻana i nā hana ma o ka hoʻokele kaʻina

• Aʻole e hōʻemi: ʻO nā hōʻailona misitor koʻikoʻi-wax make ma waena, ka lumi lumi nui, ʻO Pour papa hana-e mālama i keʻano o ka-cend i loko o loko o ka waihona ± 0.2 }m.
• Hoʻohui hoʻohui hoʻohui: Mālama nā loiloi hoʻolālā hoʻolālā i nā hana hoʻokūkū a me nā kiʻina e pale ai i nā'āpana likeʻole e hoʻopiliʻia.
• Nā'ōwili piha: Nā papa i hoʻolaʻaʻia no ka pāpāʻana, kūhā, a me ka electrophishing e hui pū me ke akamai a hōʻemi i nāʻano likeʻole, ʻokiʻoki i ka hana hou 20 %.

11. Ke hoʻohālikelike nei i nāʻenehana a me nā innovations

Mea hoʻohuiʻaha (3D-PRGTED WAX / POYME)

• Nā hiʻohiʻona polymeric (Lapala, Dlp): Hāʻawi i ka mānoanoa 25 }m; E like me RAC 1.2-2.5 μM.
• E hoʻokaʻawale i nāʻenehana: ʻO Vapor Smoothing (IPA, Acetone) hōʻemi i ka ra ~ 0.8 μM ma mua o ka heleʻana. Hoʻemi i ka pono no nā lole stucco he nui.

ʻO nā kumuwaiwai: Nano-sio ₂, Nā Hale Hōʻike Hou

• Nano-Pule Slirries: Nā COCEMIC SLS me ~ 20 NM BIET BEET BEICKS ENTRA-TALL CHARS PEATS CHATS, hoʻokō i ka hana mua o 03-0.5 μm ma nā hiʻohiʻona.
• Resin ions a me nā mea paʻa zolite: Hoʻolako i ka ikaika'ōmaʻomaʻo maikaʻi a me nā mea liʻiliʻi, ka ho'ēmiʻana i nā micro-pit, E like me ka-star ra 0.6-0.9 μm i nā mea kanu.

ʻO Simulation a me Tigital TWIN no ka wānanaʻana i ka paʻakikī

• Nā Kūlana Kūʻai Kūʻai Kūʻai (Cfd): Nā models molten i nā kahe, ʻO ka wānana houʻana i nā zonaxidation e hoʻoponopono ai me nā hemahema o kaʻaoʻao.
• ʻO ka hoʻohālikelikeʻana o ka hoʻohemoʻana: E wānana i nā kumukūʻai kūloko kūloko; E hoʻomaopopo i nā hotspots kahi kahi e hoʻonui ai i ka hoʻonuiʻana i ka papa.
• Digital Twin Repback: ʻO kaʻikepili maoli-manawa maoli (Thiss, No nā mea kanu, hau hau hau) hānaiʻia i loko o nā hoʻoponopono algorithms algorithms-automated e hoʻomau i ka hana i loko o loko o ± 0.1 }m.

Automation ma ka hale, E ninini ana, Aʻo ka hoʻomaʻemaʻe

• ʻO Robotic Shell e kāʻili ana i nā kahua: Noho ka mea hoʻokele i nā manawa a me ka noiʻana o Stucco i ka mānoanoa i loko o loko o ± 0.05 mm.
• Nā wahi kumu lāʻau automated: ʻO ka mika metter ult superheat a me ke kaheʻana (± 1 ° C, ± 0.05 m / s), ka liʻiliʻiʻana i ka turbungence.
• ʻO Ultrasonic Sheltrasonic Shelval a me ka hoʻomaʻemaʻe ultrasonic: E hōʻoiaʻiʻo i nā kinipōpō a me ka hoʻokaʻawale houʻana, ka hāʻawiʻana i ka RACK 0.1 }m.

12. Hopena

ʻO ka mea kūʻai aku i ka mea kūʻai akuʻo Wall.

Akā e loaʻa ana a mālama i ka hoʻopauʻana i kahi kiʻekiʻe kiʻekiʻe (Ra ≤ 0.8 }m, aʻoi aku paha no nā noi koʻikoʻi) pono i ke kāohi ponoʻana ma luna o kēlā me kēia alahele-mai Wax Modent hoʻolālā ma o ka hale o ka kāmaʻa, Kauhi, a me ka ho'ōlaʻana.

Ma ka hoʻolahaʻana i nā hoʻomaʻamaʻa maikaʻi maikaʻi loa, kaʻina hana hoʻonohonoho, a hui pū i nā mea hoʻolālā hoʻolālā-hana hiki ke hāʻawi i nā mea hoʻopukapuka e hoʻolei i nā'āpana me nā wānana,

ʻO ka lele kiʻekiʻe kiʻekiʻe e hoʻopau ai i kēlā mechanical, hanakino, a me nā koi noestthetic ma waena o Aerospace, olakino, aitompetitive, a ma waho aʻe.

Nānā i mua, hoʻomau i nā mea hana i nā kumuwaiwai, 'ūpō, a me nā māhoe liʻiliʻi e ho'āla i ka pā, Hoʻokuʻuʻia ka hoʻokele waiwai e noho ana e noho i kahi koho premier no ka kiko'ī maikaʻi loa, Nā Kūlana Kūʻai Kūʻai.

 

Hāʻawiʻo Deze i nā lawelawe kūʻai kūʻai kālā kiʻekiʻe kiʻekiʻe

ʻO kēia kū ma ka mua o ka hoʻopukapuka kālā, Ke hoʻopuka nei i ka'ōlelo pololei a me ka hana ponoʻana no nā noi misionari.

Me kahi hana kūponoʻole i ka maikaʻi, Ke hoʻololi nei mākou i nā hoʻolālā paʻakikī i nā'āpana āpau eʻoi aku ma mua o nāʻoihanaʻoihana no ka pono o nāʻoihana no ka dimensional, kūlike loa ka helehelena, A me ka hana mechanical.

ʻO kā mākou loea i nā mea kūʻai aku ma Aerospace, aitompetitive, olakino, a me nā meaʻona o ka ikehu e hoʻonāukiuki ai i nā mea i hanaʻoleʻia e pili ana i kēlā me kēia e pili ana i ka heluʻana o nā papa, lawehala, a me ka uku uku.

Ma ka hoʻomau mauʻana i nā lako holomua, ʻO ka hōʻoia o ka'ikeʻikepili data-Driven, a me ke kākoʻoʻenehanaʻenehana,

ʻO kēia nā mea e hāʻawi aku i nā hoa hana e hoʻoponopono ai i ka hoʻolālā huahana, hoʻemi i ka pilikia, a loaʻa i ka hana koʻikoʻi ma kā lākou mau papahana koi.